Apple presents M3 Ultra, the most powerful Mac chip

Apple has presented the M3 ultra performance chip, which integrates the most powerful CPU and GPUs in a MAC, a neural Engine with twice the nuclei, unified memory and support for Puerto Thunderbolt 5.

A CPU and GPU that exceed previous generations

M3 ultra It is the most powerful chip for Mac, designed by Apple that has a CPU of up to 32 cores (24 performance and 8 efficiency), which allows a performance to be achieved up to 1.5 times higher than that of the Ultra M2 and up to 1.8 times higher than the Ultra M1. It also incorporates the largest GPU in an Apple chip, with up to 80 graphic nuclei, which is up to twice as quickly as The ultra m2 and up to 2.6 times faster than that of the ultra M1.

Advances in graphic architecture and support for AI

The graphic architecture of the M3 Ultra includes dynamic storage in cache, in addition to mesh shadow due to ‘hardware’ acceleration and ray layout. In addition, it supports the functions of Apple Intelligence by the hand of the 32 -core Neural Engine.

Designed to enhance artificial intelligence

Apple ensures that all ultra M3 components are designed to squeeze artificial intelligence to the maximumincluding automatic learning accelerators of the CPU, the most powerful GPU of Apple, the Neural Engine and the more than 800 GB/s unified memory bandwidth. This allows professionals who work with artificial intelligence to use the new Mac Studio with M3 Ultra to execute large -sized language models with more than 600,000 million parameters on the device itself.

Apple’s support in avant -garde technology

“The ultra chip is the maximum expression of our system architecture in scalable chip and is specifically thought for those users who execute applications that require many threads and bandwidth”highlighted the Senior Vice President of Apple hardware technologies, Johny Srouji, in a press release.

Also, M3 Ultra also has support for the Thunderbolt 5 connection port, which It offers data transfer speeds up to 120 GB/s, more than double than with Thunderbolt 4.

Key innovations in chip design

This Chip integrates Apple’s most advanced technologies, such as ultrafusion packaging, which uses an intermediator that connects two MAX M3 chips through 10,000 signalswhich provides more than 2.5 TB/s low latency bandwidth between the two chips and allows the ultra M3 to function as a single chip in its interaction with the software, according to Europa Press.

Greater capacity in video editing and multimedia processing

The multimedia engine, meanwhile, It offers twice the resources that the M3 Max can process much more video simultaneously. In addition, the chip has specific ‘hardware’ components for H.264 and HEVC, and four prore coding and decoding engines, which allows M3 ultra to play up to 22 Prores Video sequences 422 8k.

Support for multiple monitors and maximum security

The screen engine allows to connect up to eight Pro Display XDR monitors with more than 160 million pixels. AND Secure Enclave works with secure start -up booting by ‘hardware’ and execution time protection technologies to guarantee first level security.